Intel

Job Details: Job Description: With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process and packaging technology, chiplets, software solutions, robust ecosystem and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel’s secure, resilient and sustainable source of supply. As product innovations continue to grow in power and intricacy, so does our need for people who can solve complex challenges at our fabs around the world. We are looking to hire in our Arizona, Oregon, and New Mexico locations. Career Opportunities Our current and future opportunities for recent graduates and experienced professionals are in the following roles: Process Integration EngineersYield Engineers including Yield Analysis and Yield ModelingDevice and Device Integration EngineersDefect Reduction, Defect Metrology and Defect Control EngineersProcess and Process Development EngineersProcess Technology Design EngineerEngineering Managers If you are interested in hiring opportunities, please complete our application and be among the first who will learn about the opportunities as they arise. Qualifications:High level requirements: Engineering roles: Bachelor’s or Master’s degree in relevant field (chemical, mechanical, electrical engineering, chemistry, physics, applied mechanics, nanotechnology, semiconductor or similar field) and relevant industry experienceManagerial roles: Engineering or management degree, 3+ years of managerial experience #foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. For more information about our Open Systems Foundry and our benefits package and our commitment to a Work/ life Balance visit our Intel Foundry page: Intel Foundry | Intel Careers Job Type: Shift:Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:US, New Mexico, Albuquerque, US, Oregon, Hillsboro Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek Sr BEOL (Back-End-Of-Line) Process Integration Development engineers for our FSM HVM Global Yield organization, reporting to BEOL Process Integration manager. Selected candidates will work with other members in BEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers. BEOL (Back-End-Of-Line) Senior Process Integration Development engineers' responsibilities include (but not limited to): Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.Collaborate with Technology Development and Local Yield teams to import new technology to production fabs.Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.Perform feasibility studies, plan and conduct experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.Own NPI (New Product Introduction) in production fabs and perform product-specific process optimizations to meet foundry customers specifications and requirements.Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost/improve fab efficiency.Engineering support for technical interactions with internal and external customers. #foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Qualifications:Minimum Qualifications Engineering, Physics, Chemistry or Materials Science or any STEM related field.Electrical/ElectronicBS degree in one of the following disciplines; 6-8 years of experience in advanced node semiconductor industry in BEOL Process Integration (preferably with experience in SADP/SAQP, advanced metallization, immersion lithography/EUV).Working level understanding of Device Physics and backend critical parameter control.Basic understanding and collaboration experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology. Preferred Qualifications: Advanced (Masters/PhD) degree in one of the following disciplines with at least; Electrical/Electronic Engineering, Physics, Chemistry or Materials Science or any STEM related field.4 years of experience in Statistics and machine learning preferred Experience in project/program management and/or Task Force Team lead.Ability to extract and analyse key parametric data related to BEOL semi-conductor processing. Capable of basic automation of routine data extracts.Experience in Statistics and machine learning preferred Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek Sr. FEOL (Front-End-Of-Line) Process Integration Development Engineers for our FSM HVM Global Yield organization, reporting to FEOL Process Integration Engineering Development Manager. Selected candidates will work with other members in FEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers. Sr. FEOL Integration Development Engineer's responsibilities include (but not limited to): Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.Collaborate with Technology Development and Local Yield teams to import new technology to production fabs.Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.Perform feasibility studies, plan and conduct experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.Own NPI (New Product Introduction) in production fabs and perform product-specific process optimizations to meet foundry customers specifications and requirements.Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost.Engineering support for technical interactions with internal and external customers. #foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Qualifications:Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field9+ years of experience in advanced node semiconductor industry in FEOL Process Integration in one (or more) of the following segments: Fin, Gate or PC, Spacer/Source-Drain or Junctions, RMG (Replacement Metal Gate), or Contact / MOL (Middle of the Line).Experience on Device Physics and in advanced nodes FinFET technology, GAA (Gate-All-Around) in development or high-volume manufacturing.Experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology. Preferred Qualifications: Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field.Experience in project/program management and/or Task Force Team lead.Experience at leveraging big data analysis to identify process design weaknesses and/or manufacturing weaknesses in order to propose corrective, data-based solutions.Experience in extracting insights from structured and unstructured data by quickly synthesizing large volumes of data and applying statistics and machine learning.Experience in new semiconductor technology development.Experience in Statistics and Machine Learning. Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created the HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This position is for a Senior Engineer in the Device Integration team in the FSM HVM Global Yield organization, reporting to the Manager/Director of Device Integration Engineering. The selected candidate will work with other members in Global Yield org including Process Integration, Yield Analysis and Defect engineering teams, fab module/yield teams and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers. The Device Integration engineer's responsibilities include (but are not limited to): Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.Collaborate with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.Participate or lead cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets.Own NPI (New Product Introduction) in production fabs and perform device-related process optimization to meet foundry customers product specifications and requirements.Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance.Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line. #foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Qualifications:Minimum Qualifications: Bachelor's degree in Electrical Engineering, Physics or Materials Science major. Other related science and engineering degrees can be considered based on industry experience.6+ years' experience in advanced node semiconductor industry in Device Integration.Experience in FinFET technology development or high-volume manufacturing.Experience with Device Physics and hands-on application in real-world fab environment.Experience with FEOL (Front-End-Of-Line) Integration teams including Fin, Poly, Source-Drain and Gate segments on Device performance improvement and targeting with technical understanding on how FEOL process changes impact Device parameters. Preferred Qualifications: Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major.Experience in project/program management and/or Task Force Team lead.Demonstrated interpersonal skills including influencing, engaging, and motivating.Experience in serving external Foundry customers through technical interactions.Experience in GAA (Gate-All-Around) technology architecture.Experience in new semiconductor technology development.Basic understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology. Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek a Principal Engineer in the Device Integration team in the FSM HVM Global Yield organization, reporting to the Director of Device Integration Engineering. The selected candidate will own multiple projects in Device Engineering and will lead cross-organizational Task Force Teams, including but not limited to new device characterization, customization and productization, supporting internal and external customers. The Principal Device Integration Engineer’s responsibilities include (but are not limited to): Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.Collaborate with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.Lead a cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets.Lead a group of device engineers to improve and maintain device performance in a high volume manufacturing environment.Own NPI (New Product Introduction) in production fabs and perform device-related process optimization to meet foundry customers product specifications and requirements.Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance.Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line. Candidate should possess the following behavioral skills: Problem-solving technique with strong self-initiative and self-learning capabilities.Ability to work with multi-functional, multi-cultural teams.Must demonstrate solid communication skills. QualificationsMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Qualifications: Master's or Ph.D. in Electrical Engineering, Physics or Materials Science major. Ph.D. degree is preferred. Other related science and engineering degrees can be considered based on industry experience.10+ years of engineering experience in advanced node semiconductor industry in Device Integration engineering.5+ years of engineering experience in FinFET technology development or high-volume manufacturing. Experience in GAA (Gate-All-Around) technology architecture is preferred.Working knowledge in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.Hands-on experience in serving external Foundry customers through technical interactions.Problem-solving and project/program management experience with strong self-initiative and self-learning capabilities.Proven track record of working across organizations through matrix structures to accomplish strategic objectives with conflicting priorities.Must demonstrate strong communication skills.Hands-on experience in new semiconductor technology development is strongly preferred. #Foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek FEOL (Front-End-Of-Line) Process Integration Development engineering roles in FSM HVM Global Yield organization, reporting to FEOL Process Integration Engineering Development manager. Selected candidates will work with other members in FEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.FEOL (Front-End-Of-Line) Integration Development engineers’ responsibilities include (but not limited to): • Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. • Collaborate with Technology Development and Local Yield teams to import new technology to production fabs. • Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases. • Perform feasibility studies, plan and conduct experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product. • Own NPI (New Product Introduction) in production fabs and perform product-specific process optimizations to meet foundry customers specifications and requirements. • Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost. • Engineering support for technical interactions with internal and external customers. Qualifications:Bachelor’s degree in science and engineering major, with at least 15-18 years of experience.Experience in advanced node semiconductor industry in FEOL Process Integration (preferably in one (or more) of the following segments: Fin, Gate or PC, Spacer/Source-Drain or Junctions, RMG (Replacement Metal Gate), Contact / MOL (Middle of the Line)). Level of experience will be considered in determining applicants job grade.Working level understanding on Device Physics and experience in advanced nodes (FinFET technology, GAA (Gate-All-Around)) in development or high-volume manufacturing.Basic understanding and collaboration experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.Experience in Statistics and Machine Learning preferred. Preferred Qualifications: Advanced degree (Master’s or Ph.D.) in Electrical Engineering, Physics, Chemistry or Materials Science major is preferred, with at least 12-15 years of experience.Experience in project/program management and/or Task Force Team lead.Must demonstrate solid communication skills.Ability to work with multi-functional, multi-cultural teams.Demonstrated interpersonal skills including influencing, engaging, and motivating.Problem-solving technique with strong self-initiative and self-learning capabilities.Ability to leverage big data analysis to identify process design weaknesses and/or manufacturing weaknesses in order to propose corrective, data-based solutions.Ability to extracts insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics and machine learning.Experience in new semiconductor technology development.Experience in serving external Foundry customers through technical interactions.Experience in GAA (Gate-All-Around) technology architecture. #Foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Details: Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers. This job requisition is to seek BEOL (Back-End-Of-Line) Process Integration Principal / Sr. Principal engineering role in FSM HVM Global Yield organization, reporting to BEOL Process Integration manager. Selected candidate will own technical projects and lead other members in BEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers. BEOL (Back-End-Of-Line) Integration Principal engineer's responsibilities include (but not limited to): · Lead complex and cross-organizational engineering projects to execute HVM yield roadmap, device targeting and attain performance targets, focusing on Cu BEOL integration. · Partner with BEOL Technology Development team to lead new technology transfer projects to production fabs. · Lead a group of FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases. · Own NPI (New Product Introduction) in production fabs and lead engineering tasks for product-specific process optimizations to meet foundry customers specifications and requirements. · Lead engineering projects to improve product yield, quality, performance and to reduce wafer cost. · Coordinate Process Integration team engineering support for technical interactions with internal and external customers. Qualifications:Master's or Ph.D. in Electrical Engineering, Physics or Materials Science major.15+ years of engineering experience in advanced node semiconductor industry in Cu BEOL Process and Integration.10+ years of experience in technology development or high-volume manufacturing. Integration experience in EUV-enabled technology nodes is strongly preferred.10+ years of experience in interaction with MOL module (Middle-Of-Line, Contact module).10+ years of experience in collaborating with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.Hands-on experience in new semiconductor technology developmentProblem-solving and project/program/TFT leadership experience with strong self-initiative and self-learning capabilities.Proven track record of working across organizations through matrix structures in order to accomplish strategic objectives with conflicting priorities.Demonstrated interpersonal skills including influencing, engaging, and motivating.Must demonstrate strong communication skills.Ability to work with multi-functional, multi-cultural teams. #Foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Job Type: Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Hsinchu Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Details: Job Description: Provides technical support by phone, chat, email, and web ticketing interfaces to internal and external customers on software, hardware, and business processes and services. Provides necessary support to integrate and test computer environment systems. Installs, configures, and supports hardware that requires any physical adjustments, diagnosis problems in wiring, cabling, and other hardware issues and helps with commission and decommission of hardware. Helps the team to drive operational improvements and publishes reports on Key Performance Indicators (Service targets, Customer satisfaction, etc.). Collaborates and interacts with end users, IT Business partners, System Architects and other members of the support teams to ensure best support practices are implemented. Supports investigations and resolves production issues, configures and codes simple data fixes, and performs other operational tasks. Qualifications:Diploma or above education background Strong ownership with good integrity Good logical thinking and fast learning capability Good communication skill High team work spirit Job Type:Experienced Hire Shift:Shift 1 (China) Primary Location: PRC, Dalian Additional Locations: Business group:Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this position you will be supporting organization operations to establish effective maintenance program toward best in class in safety, cost effective, interrupt free and conformant to ISO standard. Responsibilities will be included but not limited to: � 2-3 month internship supporting multiple manufacturing organizations. � Data analysis and report generation; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. � Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability. The successful candidate should exhibit the following behavioral traits: � Customer Orientation. � Communication skills. � Develop creative approaches/solutions. � Self-starter and team player. � Organization and prioritization skills. Qualifications:� The candidate must be Malaysia Citizen and undergoing one of the following educational requirements: Degree in Chemical/Mechanical/Mechatronic/Materials/ Electrical Engineering, Computer Science, Data Science, IT or equivalent. � CGPA Min 3.0 � Experience in MS office (Word, Excel, Powerpoint) Preferred Qualifications: � Effective programing and data fluency skills with a high tolerance for ambiguous and dynamic situations. � Demonstrated learning mindset on new equipment and systems. � Ability to work fast and agile in a matrixed environment. � Experience in Programming like: Power BI, Excel macro or Visual Basic Job Type:Student / Intern Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this position you will be supporting organization operations to establish effective maintenance program toward best in class in safety, cost effective, interrupt free and conformant to ISO standard. Responsibilities will be included but not limited to: 2 - 3 months internship supporting multiple manufacturing organizations. Data analysis and report generation; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability. The successful candidate should exhibit the following behavioral traits: Customer orientation. Communication skills. Develop creative approaches/solutions. Self-starter and team player. Organization and prioritization skills. Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: The candidate must be Malaysia Citizen and undergoing one of the following educational requirements: Degree in Chemical/Mechanical/Mechatronic/Materials/ Electrical Engineering, Computer Science, Data Science, IT or equivalent. CGPA Min 3.0 Experience in MS office (Word, Excel, PowerPoint). Preferred Qualifications: Effective programming and data fluency skills with a high tolerance for ambiguous and dynamic situations. Demonstrated learning mindset on new equipment and systems. Ability to work fast and agile in a matrixed environment. Experience in Programming like: Power BI, Excel macro or Visual Basic. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Job Type:Student / Intern Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: Job Description Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this position you will be supporting organization operations to establish effective maintenance program toward best in class in safety, cost effective, interrupt free and conformant to ISO standard. Responsibilities will be included but not limited to: � 2-3 month internship supporting multiple manufacturing organizations. � Data analysis and report generation; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. � Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability. The successful candidate should exhibit the following behavioral traits: � Customer Orientation. � Communication skills. � Develop creative approaches/solutions. � Self-starter and team player. � Organization and prioritization skills. Qualifications:Job Qualifications � The candidate must be Malaysia Citizen and undergoing one of the following educational requirements: Degree in Chemical/Mechanical/Mechatronic/Materials/ Electrical Engineering, Computer Science, Data Science, IT or equivalent. � CGPA Min 3.0 � Experience in MS office (Word, Excel, Powerpoint) Preferred Qualifications: � Effective programming and data fluency skills with a high tolerance for ambiguous and dynamic situations. � Demonstrated learning mindset on new equipment and systems. � Ability to work fast and agile in a matrixed environment. � Experience in Programming like: Power BI, Excel macro or Visual Basic Job Type:Student / Intern Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: Our internship programs cater best to students who have the ambition to make the world a better place through technology and constantly challenge the boundaries of what is possible.You will be involved in large-scale data mining, data visualization, and machine learning algorithms used to make a prediction or classification.You will work with a diverse team of engineers who are delivering technical solutions to manufacturing process challenges.Gather, assemble, and verify data that will be used for a variety of purposes.Support and implement initiatives for continual engineering improvements.Assist in the modification of existing analysis and creation of new analysis.Perform other duties and projects as assigned by the manager. Qualifications:Pursuing bachelor's degree in computer science, Artificial Intelligent - Machine Learning, or any related disciplinesProficient in programming or scripting language e.g. SQL, Phyton; data visualization tool e.g. Power BI.Exceptional communication and interpersonal skills are necessary regularly communicates with internal and external stakeholders.Analytical skills, resourcefulness, and the ability to work in a team are necessary.Proactive, dedicated, innovative, and quick problem-solving abilities. Job Type:Student / Intern Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: Responsibilities may be quite diverse and are technical in nature. U. S. experience and education requirements will vary significantly depending on the unique needs of the job. Qualifications:Technical individuals who are passionate to try out the latest development methods, explore and bringing innovations to current applications. Candidates passionate in React, .NET, SQL, GitHub, SAFe/Agile Development and requirement gathering and analysis with end customers. Job Type:Intel Contract Employee Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group:Intel's Information Technology Group (IT) designs, deploys and supports the information technology architecture and hardware/software applications for Intel. This includes the LAN, WAN, telephony, data centers, client PCs, backup and restore, and enterprise applications. IT is also responsible for e-Commerce development, data hosting and delivery of Web content and services. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Manufacturing internship to supports Manufacturing system, Manufacturing executions System and Factory systems or applications Qualifications:Bachelor of Electrical Engineering, Mechanical Engineering, Computer Science Job Type:Student / Intern Shift:Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence.

Job Details: Job Description: With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process and packaging technology, chiplets, software solutions, robust ecosystem and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel’s secure, resilient and sustainable source of supply. As product innovations continue to grow in power and intricacy, so does our need for people who can solve complex challenges at our fabs around the world. We are looking to hire in our Kiryat-Gat, Israel location. Career Opportunities Our current and future opportunities for recent graduates and experienced professionals are in the following roles: Process Integration EngineersYield Engineers including Yield Analysis and Yield ModelingDevice and Device Integration EngineersDefect Reduction, Defect Metrology and Defect Control EngineersProcess and Process Development EngineersEngineering Managers If you are interested in hiring opportunities, please complete our application and be among the first who will learn about the opportunities as they arise. Qualifications:Qualifications: High level requirements:Engineering roles: Bachelor’s or Master’s degree in relevant field (chemical, mechanical, electrical engineering, chemistry, physics, applied mechanics, nanotechnology, semiconductor or similar field) and relevant industry experienceManagerial roles: Engineering or management degree, 3+ years of managerial experience #foundry Important: Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel IS. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. For more information about our Open Systems Foundry and our benefits package and our commitment to a Work/ life Balance visit our Intel Foundry page: Intel Foundry | Intel Careers Job Type: Shift:Shift 1 (Israel) Primary Location: Israel, Kiryat-Gat Additional Locations: Business group: Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: As a part of Intel’s data center & AI business, you will collaborate with a team of engineers focused on signal integrity as it pertains to Intel’s platforms and board designs. As an intern, you will develop new/existing tools to increase automation and organization of measured data. This will involve developing indicators based on the processed data along with integrating and developing quality checkers within the existing tool’s framework. As you interact with the team, it is expected that you will learn and apply signal integrity fundamentals. Throughout the internship, you will continuously interact with other engineers and stakeholders across several groups to accomplish high quality results for our platforms and customers. The ideal candidate should exhibit the following behavioral traits: Provide leadership and results. Excellent written and verbal communication skills Collaborate with others constructively. Work independently and develop solutions. The intern duration will be 6 to 12 months based on business needs. Qualifications:Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This is an entry level position and will be compensated accordingly. Minimum Qualification Actively pursuing a master’s degree in computer science, electrical engineering or computer engineering Experience or coursework in computer science fundamentals and application Matlab, Python, other applicable computer science languages (Java, C, C++, etc.) Hardware design / computer architecture basics Job Type:Student / Intern Shift:Shift 1 (United States of America) Primary Location: Virtual US Additional Locations: Business group:The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California:$63,000.00-$166,000.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs. The application window for this job posting is expected to end by 06/18/2024

Job Details: Job Description: Intel is on a multi-year supply chain transformational journey. The Integrated Device Manufacturing 2.0 (IDM 2.0) Acceleration Office (IAO) is responsible for creating the internal foundry model within Intel that will power the next phase of our IDM 2.0 strategy. Implementing an internal foundry model means significant transformation to Intel's Supply Chain. The Equipment Configuration Management Program team is chartered with delivering and maintaining capabilities around the creation and maintenance of a single source of record for equipment configurations of factory equipment and the respective bill of materials (BOM) in Windchill. We are looking for a seasoned Windchill developer with experience designing and developing complex data structures, enabling workflow capabilities for internal and supplier (external) users, and integrating with other planning, master data and enterprise systems. The Enterprise Factory Equipment & Procurement team in Supply Chain IT is seeking a Windchill PLM experienced developer to perform (but not limited) to the following activities: The Windchill PLM experienced developer will be responsible to perform the following activities: Design customizations and extensions through modifying existing Windchill PLM solutions to correct errors or to upgrade interfaces and improve performance. Troubleshoot, debug and upgrade existing software for Windchill PLM Solution. Analyze data models and configure accordingly. Develop scripts as needed for mass data updates and migrations. Develop integrations with other ERP and data systems. Manage builds with GIT repository practices and prepare deployments. Develop custom handlers, user extensions, custom scripts, client-side customization, and web services. Other soft skills include: To serve as a technical lead on a subsystem or small feature(s). Manage projects of small to medium size and complexity, performs tasks, and applies expertise in subject area to meet deadlines. Demonstrated ability to effectively communicate in technical and non-technical terms, at all levels, within and outside the organization, with strong written and verbal communication skills. Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications The candidate must have a Bachelor’s Degree in Engineering, Computer Science or other STEM related degree and 4+ years of experience in: Windchill PLM 12, PDMLink, ProjectLink, and PTC's product suite. Agile/SAFe methodologies, and skilled in using JIRA Align. Experience managing system config changes over time, across multiple environments. Windchill 12, ACLs, OIR’s, Lifecycles, Workflows, InfoTasks, Webjects, actions/action-models. Java, JSP, JavaScript, J2EE, XML for modification of Windchill. Windchill Platform Structures Management, Part Classification, and Supplier Management. Windchill integration to SAP ERP 6.0 or SAP S/4. Experience with custom UI. Experience with data and system management such as data imports/exports, in-app business support via validations and problem analysis of data and configurations. Excellent customer interfacing to coordinate requirements, status updates. Agile/Scrum and ITIL methodologies, and tools such as Jira and ServiceNow. Experience developing and delivering end user training. SIT & UAT Testing experience enhancements, deployment, and go-live support. Preferred Qualifications Thingworx Connected PLM and Thingworx Navigate. Recommended Certifications PTC Windchill Business Administration. PTC Windchill System Administration. Job Type:Experienced Hire Shift:Shift 1 (United States of America) Primary Location: Virtual US Additional Locations: Business group:Intel's Information Technology Group (IT) designs, deploys and supports the information technology architecture and hardware/software applications for Intel. This includes the LAN, WAN, telephony, data centers, client PCs, backup and restore, and enterprise applications. IT is also responsible for e-Commerce development, data hosting and delivery of Web content and services. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California:$123,419.00-$185,123.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs. The application window for this job posting is expected to end by 09/06/2024

Job Details: Job Description: Intel is on a multi-year supply chain transformational journey. The Integrated Device Manufacturing 2.0 (IDM 2.0) Acceleration Office (IAO) is responsible for creating the internal foundry model within Intel that will power the next phase of our IDM 2.0 strategy. Implementing an internal foundry model means significant transformation to Intel's Supply Chain. The Equipment Configuration Management Program team is chartered with delivering and maintaining capabilities around the creation and maintenance of a single source of record for equipment configurations of factory equipment and the respective bill of materials (BOM) in Windchill. We are looking for a seasoned Windchill PLM Business/Systems Analyst with experience gathering requirements, understanding of complex data structures, which will enable workflow capabilities for internal and supplier (external) users, and integrating with other planning, master data and enterprise systems. Job Description: The Equipment Configuration Management team in Supply Chain IT is seeking an experienced Windchill PLM Business/Systems Analyst to join an exciting team at Intel! Activities to include: Collecting and analyzing information from system users to formulate the scope and objectives of the system to meet business outcomes. Documenting business processes and gain alignment across business groups. Working closely with business stakeholders to develop and deliver training and maintain application documentation. Developing use cases, business scenarios, and/or demos; planning and coordinating testing and providing end user support. Creating and maintaining dashboards and reports. Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications The candidate must have a Bachelor’s Degree in Engineering, Computer Science or other STEM related degree and 4+ years of experience in: Windchill PLM 12, PDMLink, ProjectLink, and PTC's product suite. Windchill Platform Structures Management, Part Classification, and Supplier Management (SUMA). Data and system management such as data imports/exports, in-app business support via validations and problem analysis of data and configurations. Customer interfacing to coordinate requirements, status updates, enhancements, Agile/Scrum and ITIL methodologies, and tools such as Jira and ServiceNow. Developing and delivering end user training. SIT & UAT Testing experience, deployment, and go-live support. Preferred Qualifications Customizations of ACLs, Lifecycles, Workflows, InfoTasks, Webjects, OIRs, actions/action-models. Understanding of BOM Structures. Recommended Certification: PTC Windchill Business Administration. SCRUM Certification. Job Type:Experienced Hire Shift:Shift 1 (United States of America) Primary Location: Virtual US Additional Locations: Business group:Intel's Information Technology Group (IT) designs, deploys and supports the information technology architecture and hardware/software applications for Intel. This includes the LAN, WAN, telephony, data centers, client PCs, backup and restore, and enterprise applications. IT is also responsible for e-Commerce development, data hosting and delivery of Web content and services. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California:$99,487.00-$149,235.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs. The application window for this job posting is expected to end by 09/06/2024

Job Details: Job Description: Do Something Wonderful! Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, let’s do something wonderful together. Join us, because at Intel, we are building a better tomorrow. The Client Graphics, GPU IP, and AI (CGAI) group is responsible for delivering industry-leading GPU IP (3D, media, display, compute) to all of Intel's business units and their market segments, including for the client, high-performance computing and AI, and edge computing. CGAI is also responsible for the development of specialized IP for the NPU (Neural Processing Unit) and AI model deployment across Intel's hardware for the AI PC. Additionally, all aspects of client graphics engineering and management of the Intel Arc graphics portfolio and business is included within the purview of CGAI. We are looking for passionate individuals to help define and build the next generation of highly efficient GPU architectures for AI and HPC for Intel. The role responsibilities includes but not limited to: Developing compute benchmarks/macros for next generation GPU compute platform Workload analysis and performance debug to identify bottlenecks and drive resolution through hardware and/or software fixes. Assess new SW/HW innovations and drive the most relevant into the GPU Architecture definition. Function and performance modeling for new GPU compute features. Behavior skill we are looking for: Aptitude to learn new things quickly in this fast-changing domain. Flexibility to work on any mix of the above roles as needed. Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of research and relevant previous job and/or internship experience. Minimum Qualifications: Bachelors Degree in Computer Science, Electrical Engineering, Computer Engineering, Mathematics or similar relevant degree and 5+ years experience, or Masters Degree in Computer Science, Electrical Engineering, Computer Engineering, Mathematics or similar relevant degree and 3+ years experience, or PhD Degree in Computer Science, Electrical Engineering, Computer Engineering, Mathematics or similar relevant degree and 1+ years experience GPU/CPU Architecture Proficiency in C/C++ and Python Knowledge of GPU compute architecture GPU Kernel and performance debugging Preferred Qualifications: Knowledge/Experience in performance modeling. Experience in building analytical and/or simulation-based performance models Experience/Knowledge in Machine Learning/Deep Learning workloads. Job Type:Experienced Hire Shift:Shift 1 (United States of America) Primary Location: Virtual US Additional Locations: Business group:The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California:$144,501.00-$217,311.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs. The application window for this job posting is expected to end by 09/30/2024

Job Details: Job Description: You will help us to provide strong support for the Intel Compiler products going forward: you will be responsible for analysis of applications and benchmarks, as well as definition, design, development, test, debugging, release, enhancement, and maintenance of software tools for domain specific programming languages. You may work directly with hardware design team, companies and open source communities developing compilers, and participate in language and standards groups. Your responsibilities will include, but not be limited to: feature development and resolving of compiler software defects carry out functional and performance experiments, tests, including stress tests finding opportunities to improve quality of the product cross-geo collaboration with engineering, validation and performance teams across Intel to ensure product quality and performance. Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Minimum Qualifications: Bachelor's degree in Computer Science, Applied Mathematics, Informatics or a related technical discipline. 1+ years of experience in C/C++, object-oriented programming, data structures Preferred Qualifications: Master's degree or PhD. in Computer science or Computer/Software/Electrical Engineering Experience with vectorization and parallel programming models such as OpenMP, or SYCL Experience in the following areas: (compiler development, linker, assembler and C/C++ runtime libraries) Experience in Code optimization for efficient HW performance What we offer: At Intel, we offer a collaborative, supportive environment, where your equally brilliant colleagues will push you to be your best. There's no fear of failure - we know that's how innovation happens, and you'll never be bored. We offer competitive benefits and pay, opportunities for professional development and the flexibility you need to achieve balance. Intel fosters a collaborative environment allowing the brightest minds in the world to come together to achieve exceptional results. Competitive pay and Benefits: Including stock programs, Quarterly Bonuses, Employee Pension Plan, Medical plan and life insurance, Peer to peer recognition, Lunch card, Multisport Card/Holiday card, Groups of enthusiasts, Exclusive employee discounts, (online) events and many more. Opportunities for professional development and growth: You will work in an international environment within a group of the best professionals in the world, working with the newest technologies. You'll have a chance to take part in advanced development programs, conferences and have free access to a wide library of classroom and online courses, covering both soft and technical skills. Life and Community: We offer opportunities for employees to refresh and recharge- flexible working time, benefits and services that support your wellbeing, and the chance to participate in Intel's Great Place to Work program which gathers people who love running, cycling, squash, tennis, cross fit, photography, and many more. Our internships offer students a chance to get real-world experience through participation in projects from day one, as well as the opportunity to develop a wide network of industry contacts. We guarantee you will be working in a safe environment, in an organization which profoundly understands the current health situation worldwide. At both our offices and in your home, the security and wellbeing of you and your family is our utmost responsibility. Materials important for you - to learn more about Intel. Learn more about Intel in Poland: https://intel.ly/3eq8QlY Job Type:College Grad Shift:Shift 1 (Poland) Primary Location: Virtual Poland Additional Locations: Business group:Do you want to impact how thousands of software developers around the world use Intel platforms? Join the Developer Software Engineering (DSE) organization and work on the latest technology enabling compilers, debuggers, analyzers, libraries, and parallel runtimes. You will develop industry-leading software which abstracts and showcases Intel platforms, extracts peak performance, and amplifies Intel business through our Hardware and Software developer communities. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: In Q4 2023, Intel® announced Altera® (formerly named as PSG) will be reported as a separate business unit beginning on January 1, 2024, with ongoing support from Intel®. This position is associated to the standalone business strategy and is expected to fully transition to a standalone company at some time in the future. Over the next two to three years, Intel® intends to conduct an IPO for Altera® and may explore opportunities with private investors to accelerate the business's growth. Altera® is the pioneer of programmable logic solutions, enabling system and semiconductor companies to rapidly and cost effectively innovate, differentiate, and win in their markets. Altera® drives billions of revenue through hardware sales, servicing thousands of customers through its network of distributors and direct sales. Altera® Finance is a fast paced, dynamic work environment supporting Intel® FPGA technology. With the Altera® separation preparation, Altera® finance provides a unique experience, networking, and operating model to support a new business standalone. We are looking for a collaborative and process-oriented Finance Analyst to join our team. This position manages Altera® PnL consolidation processes and management reporting publications. This role interacts with many internal Altera® customers (CFO, CEO, VPs, Operation team) as well as groups from larger Intel® such as Cost and Supply Chain. The ideal candidate has a flexibility and diversity of knowledge that will allow them to understand all aspects of the PnL. What You Will Do: Consolidate and report Altera® short and long term PnL and valuation.Working with LRP, PnL, Corp, ER, accounting, and Altera® management team on PnL reporting.Working on Altera® PnL reporting structure and system.Supporting Altera® separation requirements. The successful candidate must demonstrate the following: Skills utilizing the Microsoft Office Suite of tools including Excel, PowerPoint and Word.An interest in technical Financial Systems and desire to constantly improve and find better and more efficient ways to analyze and communicate data.Strong planning, analytical and communication skills with a skill to help non-Finance audiences quickly grasp financial concepts.Demonstrated skills to work independently and deliver results in a dynamic, cross functional, team-oriented environment. Qualifications:Minimum Qualifications: You must possess the below education and minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Bachelor's degree in Finance, Economics or Accounting and 6+ years of related experience or a MBA in Finance, Economics or Accounting and 4+ years of related experience. 5+ years of finance experience in PnL, FPnA, or Cost and inventory is required.6+ years of experience with Microsoft Excel. Preferred Qualifications: Prior experience using BOBJ, JET, BPC, Power BI, iCOST, connected PnL. Job Type:Experienced Hire Shift:Shift 1 (United States of America) Primary Location: US, California, San Jose Additional Locations:US, Oregon, Hillsboro Business group:As members of the Finance team, employees act as full partners in making and supporting business decisions that are aimed at maximizing shareholder value. Intel Finance has a strong focus on facilitating change and improvement both within finance and in the operations supported. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, California:$99,487.00-$149,235.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: As a Manufacturing Network Engineer, the main responsibilities will be, but not limited to: Responsible for determination and deployment of robust, stable, and manageable computing and network services. Manage technical projects. Determine site computing and network server strategy. Research new technology, products, and tools. Monitor and perform capacity/feasibility studies and resolve network capacity issues. Identify, develop, and deploy tools supporting network server services. Perform impact analysis of new technologies on environment. Analyze and troubleshoot complex and advanced problems. Plan and schedule work to meet deadlines established by others to ensure the completion of related tasks. Use judgement in data analysis to develop and design solutions for moderately complex processes. Provide support 24x7 on-call. In addition, the ideal candidate should exhibit the following behavioral traits: Problem-solving skills. Multitasking skills. Strong communication skills. Previous experience working in a dynamic and team-oriented environment. Self-learner Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences. This is an entry level position and will be compensated accordingly. Minimum Qualifications: The candidate must have a bachelor's degree in Electrical/Computer engineering or Computer Science or Networks and Information Security Engineering, or related field. This position is not eligible for Intel immigration sponsorship. Preferred Qualifications: CCNA certification or willing to certify within 6 months. 1+ years' experience with Installing/configuring Cisco and/or related/similar network equipment. Job Type:College Grad Shift:Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:US, Arizona, Phoenix Business group:Intel's Information Technology Group (IT) designs, deploys and supports the information technology architecture and hardware/software applications for Intel. This includes the LAN, WAN, telephony, data centers, client PCs, backup and restore, and enterprise applications. IT is also responsible for e-Commerce development, data hosting and delivery of Web content and services. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Americas Marketing Team is looking for an innovative, dynamic marketing leader to join our team as our North America Consumer AI PC Marketing Segment Manager. Responsibilities may include but not be limited to: Development of the Integrated North America Consumer AI PC Marketing Strategy and GTM PlanLead cross-functional North America Consumer Marketing team (Retail Mktg, Creative, Media, Social, Partners) to flawlessly execute on the plan on a daily basisWork with US and Canada Sales Teams to support key priorities with marketing plans and programsCollaborate with HQ Product Marketing to develop plans, strategies and content that work for the North America market and our key audiencesBe the voice of North America retails sales and partners into key Global Marketing GroupWork with our Retail, OEM and ISV partners to develop and execute co-marketing opportunities aligned to our key prioritiesOwn results and measurement for marketing programs including: OKRs, quarterly management report outs and reviews.Own and manage annual budget A successful candidate will demonstrate: Strong marketing acumen including retail, social, digital, influencer and community marketing Expertise in marketing to key consumer audiences including Gen Z and Active ShoppersExpertise in the Shoppers' JourneyWilling to leverage data analytics and campaign measurement to evaluate marketing program impacts and effectiveness and make real-time adjustmentsWillingness to work in a matrixed organization and to drive collaboration, effective communication, and influence with various stakeholders across US and global organizations.Outstanding written and verbal communication and presentation skills and a solid comfort level interacting with executive management and sales leadershipSelf-starter, high level of initiative and self-motivated and strong collaboration, within a fast-paced, constantly evolving environment Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position is not eligible for Intel immigration Minimum Qualifications: Bachelor's degree in marketing, Business or Comms.10+ years experience in end-user and/or partner marketing Preferred Qualification: MBAKnowledge of Consumer Client PC industry Job Type:Experienced Hire Shift:Shift 1 (United States of America) Primary Location: US, California, Folsom Additional Locations:US, Arizona, Phoenix, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, Austin Business group:Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html Annual Salary Range for jobs which could be performed in US, California:$141,673.00-$241,005.00 Salary range dependent on a number of factors including location and experience. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: - Be the strategic technical support of Intel China's key ISV and/or SI, driving solution's co-development and co-selling (silicon + software + service), to generate Intel's revenue beyond silicon as the new revenue growth engine of Intel. - Responsible for technical relationship of all-layers in partner's organization to shape common interest business scope, generate demand, build appropriate technical collaboration models, and drive technical goal. - Identify partner's technical needs and pain points, work with internal support teams to win partner's software and/or solutions on Intel's newest technology with architectural affinities, and drive scale-out with GTM programs, measured by software design-win and its influenced silicon revenue. Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: - Familiar with IAAS/PAAS/SAAS technology, such as cloud, storage, networking, database, data analytics, AI, LLM, Edge computing and ERP etc. - Can demonstrate strong technical sales skillset and have proof of record of large account management experience. - 10+ years pre-sales or consulting experience in the enterprise-oriented IT software/service/solution market. - Result driven with can-do attitude to deal with opportunities and arising challenges. - Excellent communication (written and verbal) and interpersonal skills in both Mandarin and English. - Minimum of a bachelor's degree, MBA from top tier program preferred. - Technical leader or Entrepreneur background will be an add. Preferred Qualifications: - Business and technical insights in one or multiple areas: generative AI, services to enterprise digital transformation, multiple modal data governance, cloud native. - Previous experience of growth strategy development plans - Complex solution selling experience to enterprises. - Previous experience of business model development - Leadership in task force or cross function team - Open-minded, innovative, and entrepreneurial thinking Job Type:Experienced Hire Shift:Shift 1 (China) Primary Location: PRC, Beijing Additional Locations: Business group:Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Job Details: Job Description: Are you interested in joining a team of graphics engineers working on the next generation of Intel graphics products including Intel’s discrete graphics card? Working with leading engineers on Intel's latest GPGPU and compilers? Then our GPU Software Engineering GIA has opportunities for you. Our team’s goal is to provide high quality drivers for Intel’s graphics end users. We are looking for a GPU Compiler Engineer to join us and work with the newest technologies associated with client graphics. As a member of the GIA Compiler group, you may work with the hardware design team, companies and communities developing compilers. In this role, you will be responsible for the definition, design, and leading implementation of 3D shader compiler test content. Qualifications:Minimum Qualifications: Degree in Computer Science, Computer Engineering or equivalent 7+ years of experience in software and/or hardware commercial projects C/C++ Programming skills supported by work experience Experience in 3D graphics (Direct3D, Vulkan, OpenGL, OpenCL etc.) and/or compilers (LLVM internals, GPU/CPU technology) Strong analytical thinking and dedication Knowledge of development tools and practices according to industry standards Fluency in English Preferred Skills and Experience that will make you stand out: PhD in the field of compilers working experience related to 3D graphics i.e. game development Knowledge of computer graphics theory Experience with Windows graphics drivers internals Proficiency in using source code versioning systems: GIT Experienced technical lead/mentoring skills What we offer: At Intel, employees share in successes, enjoy comprehensive rewards and are inspired by an innovative & inclusive workplace. What can you expect when there is a match between us? We guarantee you will be working in a safe environment. Either at your own home or in our premises if needed, the security and wellbeing of you and your family stands as our utmost responsibility. You will have constant opportunities to develop your professional career through technical and soft skills training, taking part in innovation projects or rotational programs. Flexible working hours are important to us, and our amazing benefits to make life easier and more enjoyable are waiting for you: Stock Program, Annual and Quarterly Bonuses, Employee Pension Plan, Medical Plan and life insurance for you and your Family, Peer to peer recognition, Ticket restaurant Card, Multisport Card / Holiday card, Groups of enthusiasts, Exclusive employee discounts, (online) events and many more. Rewards Experience @ Intel Poland: https://jobs.intel.com/pl/benefits Job Type:Experienced Hire Shift:Shift 1 (Poland) Primary Location: Poland, Gdansk Additional Locations:Poland, Warsaw, Poland, Wroclaw Business group:The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.