Job Details:

Job Description: 

Job Description:
As an integral part of Intel's new IDM2.0 strategy, Intel is planning to invest more than 20 billion in the construction of two new leading-edge chip factories in Ohio to boost production to meet demand for advanced semiconductors, power a new generation of innovative products from Intel, and serve the needs of foundry customers. This position is the Yield and Integration Department Manager of the next US greenfield mega-site: a large-scale, multi fab, 3000+ employee operation supporting Intel's internal and foundry wafer supply.

Intel is looking for highly motivated individuals, with strong technical background, capabilities, and experience to transfer, ramp, sustain advanced technologies using state of the art equipment, materials, and techniques. They will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while delighting both internal and foundry customers.

The Ohio Yield and Integration Department Manager works a shift 1 schedule reporting to the Intel Ohio Vice President and Site Manager.

Responsibilities include:
Collaborating with the Senior Ohio Site leadership to establish and execute the Ohio Site Culture and Objectives
Recruiting, hiring, onboarding, and managing a team of technical managers and senior technologists as well as full staffing of an inclusive and diverse department
Owning the safety, well-being and employee experience for the department
Owning the training, development and productivity for the people in the department
Owning through collaboration and leadership technology and yield transfer, startup, matching and continuous improvement
Owning through collaboration and leadership the quality and yield for the site
Owning the change control for the site
Partnering with the Worldwide Intel factory network and the technology development team on overall technology improvement

Experience Required:

15+ years of Yield Engineering, Integration Engineering, Device Engineering, or Manufacturing experience or other related engineering functional areas in 300mm semiconductor manufacturing.

10+ years of relevant experience in 300mm startup and ramp of advanced logic process technologies; and planning/execution of a yield enhancement roadmap.

Direct foundry experience with satisfying customer yield roadmaps is highly desired

Advanced semiconductor processing

Technology transfer and ramp with emphasis on process tool installation and qualification

Fab engineering and manufacturing experience

Strategic Planning

Model based problem solving and Project Management experience

Change control

Yield Analysis tools (techniques and systems), Process Engineering knowledge, Process Control, device knowledge, materials analysis techniques and Fault Analysis Layout sensitivities to identify Product Yield issues and drive EOL Yields to Best in Class.

Knowledge of module tool impacts to defects, inline parametrics and yield through PM life while understanding upstream and downstream impacts to other tools.

Skills to develop continuous improvement projects at module level to improve process to give reliable, High yielding, cost effective products.

Experience in Process Integration of FINFET, Strained SiGe , Hi K dielectric+Metal Gate, Extreme Ultraviolet (EUV) Lithography plus spacer based double and quad patterning, driving continuous improvement projects to achieve Best in Class yielding, reliable products.

Strong Process flow integration knowledge including understanding of defect formation/evolution, process integrated defect and yield impacts, demonstrated influence across multifunctional fab groups to drive action to reduce defect density and drive yields higher.

Experience driving yield roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products.

Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.

Understanding of Layout sensitive defects, Design for Testability and knowledge of raster, scan diagnosis and other LYA data systems.

Knowledge of yield analysis techniques and systems, understanding of processing techniques (Lithography, Etch, Implant, CMP, CVD, plating, diffusion, thin films, etc), yield engineering data analysis tools, and working knowledge of semiconductor devices.

Once hired, this person must be willing to temporarily relocate to Portland, OR, AZ, Israel or Ireland for training assignments from 6 months to a year.

The ideal candidate should exhibit the following behavioral traits:
Demonstration of inspiring, leading and motivating a large inclusive and diverse workforce with a high sense of urgency.
Employee engagement, collaboration, teamwork and commitment within the organization, the global factory network, and partner organizations.
Apply broad and deep business and strategic acumen
Exceptional people manager (people skills) and organizational leadership, achieving results though people, establishing inclusivity and leveraging diversity
Set clear, actionable strategies and ensure accountability to execute the strategy to delight our customers and meet our business objectives
Role model courage, candor, and integrity in the face of change
Take informed risks and promote an environment that fosters innovation
Good listening and customer orientation

Qualifications:

Bachelor's, Master's or Ph.D in Engineering or science like: physics, chemistry, electrical engineering, chemical engineering, material science, industrial engineering and other engineering/science related field.

#foundry

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Ohio, Columbus

Additional Locations:

US, Arizona, Phoenix, US, Oregon, Hillsboro

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.