Job Details:

Job Description: 

The Memory and IO group in DCAI is responsible for developing the next generation of memory in collaboration with industry partners. The primary job responsibilities are as follows: Develops solutions from drawings or from scratch, creates product and test specification based on requirements, conducts design reviews, creates manufacturing drawing packages for HVM designs including PCB and/or mechanical assemblies using CAD. Defines and conducts feasibility studies and develops and implements test plans and parameters for new and existing module designs, including functionality validation, reliability, and safety. Collaborates on manufacturing and test requirements for both PCB and/or mechanical assembly products in high volume. Applies knowledge to select the right components and manufacturing technologies for the module. Develops and applies computer aided design engineering methods, theories, and techniques in the investigation and solution of technical problems. Collaborates with thermal, mechanical, and other system engineers to optimize the design parameters and deliver performance objectives. Completes physical design entry to meet both functional requirements as well as manufacturing and test requirements for PCB. Considers BOM cost and availability data versus design tradeoffs at the board level. Collaborates with architects, other platform hardware design engineers, hardware verification engineers, technical project managers, and technicians to plan and lead platform hardware power on and debug activities. Resolves system development and bring up issues to deliver high quality boards and platforms for customers.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's Degree in Electrical/Computer Engineering or Computer Science and or related field.

At least three years of experience in:

• Allegro / Cadence (or equivalent) design tools
• Collaboration with multi-disciplinary team (example: packaging, thermals, mechanicals, signaling
• Manufacturing rules for component placement and routing.
• Generation of Manufacture output files (Gerbers and ODB++)
• Stack up definition from 4 to 16 layers using standard or HDI technology.

Preferred Qualifications:

• Familiarity with fundamentals concepts in Electromagnetism.
• Programming of MATLAB, scripting for analysis, and post-processing of data.
• Experience with electrical circuits and full-wave electromagnetic simulation tools.
• Lab measurements skills for probing and RF testing with PNA
• RF Test experience
• RF Lab equipment
• Knowledge/experience working with RF components such as Baluns, Filters, Splitters, Power Amplifiers, RF switches.
• RF metrology including VNA, Signal Generators, Signal Analyzers

• Knowledge of routing rules for different topologies like DDR, PCIe, SMBUS, etc.
• Constructing floor plan for new boards, performing routing studies (low and high-speed signals).
• Defining through hole vias, blind vias, buried vias and microvias padstacks.
• Constraint manager definition.
• Component footprint creation and verification.
• Ability to interact directly with stakeholders such as Platform Architects, Power Delivery, Voltage Regulator (VR) designers, Signal Integrity, Mechanical, Design for Manufacturing (DFM) and Design for testing (DFT) team.
• Setup of artwork parameters, creation of films, drill chart, dimensions, assembly, etc.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara

Business group:

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:  https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in

US, California:$102,120.00-$169,020.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.