Job Details:

Job Description: 

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and willing to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Penang Malaysia (PGDM/APF26), increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.
Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.
The successful candidate will report to the Equipment Planning and Coordination Team (EPCoT) department. The candidate will have experience direct Lithography experience installing and qualifying tools.
Responsibilities include, but are not limited to:
� Working on Litho equipment design, install, qualification, and configuration for the module, in partnership with the transferring and receiving factory engineers, technicians, and support groups.
� As a site expert in installation/qualification of Litho tools, partners with the factory Module Area Coordinators to ensure success for the module's startup. Mentors and coaches the team (including Fab and C4) to ensure long-term success for the PGDM home team.
� Synthesizing tool requirements from Long-Range Plan data to execution, ensuring equipment installation and qualification meets all schedule milestones, Intel Corporate Safety and DMO manufacturing requirements.
� Working through the Manufacturing Readiness Checklist, ensuring capital support items are planned and available, and the equipment supplier is resourced.
� Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.
� Partnering with central support groups on tool location and layout, capital, capacity, and timing.
� Partnering with Intel's construction organization closely on design and construction planning.
� Partnering with factory engineers and technicians on tool install and qualification.
� Partnering with Corporate Services on Facility turn-on and Environmental Health and Safety (EHS).
� Be the champion to ensure the equipment is performing to expectation, working alongside 24/7 technician team to troubleshoot equipment issues, and to support startup of sustaining operations.
� Actively participating in technician and engineer training and mentoring to further the technical development of the entire workforce.
� Developing solutions to problems utilizing statistical knowledge and problem-solving tools and developing strategies to prevent the recurrence of problems in the future.
� Gains deep understanding of Intel's various software solutions used to monitor execution of install/qual, and advocates for adoption across the workgroup.
� As the EPCoT team creates local business processes for a new factory, the candidate will be asked to take the lead on establishing the process including benchmarking other sites, creating supporting documentation, tracking adoption, and establishing training materials.

The ideal candidate exhibits the following behavioral traits:
� Places high priority on the safety of themselves and those around them.
� Excellent communication skills with a high tolerance for ambiguous and changing situations.
� Strong technical and troubleshooting skills and a desire to learn new processes and tools.
� Willingness to complete a temporary assignment or frequent travel in the US to learn the new technologies and process equipment, if necessary.
� Prepared to make informed technical decisions and providing direction.
� Work well in a matrixed environment and build cohesive teams.

Qualifications:

Minimum Requirements:
� BS in Chemical/Mechanical/Mechatronic/Materials/Electrical Engineering or equivalent, with 6+ years industry experience in semiconductor field
� MS in Chemical/Mechanical/Mechatronic/Materials/Electrical Engineering or equivalent, with 4+ years industry experience in semiconductor field
� Industry experience focused on tool installation/qualification specific to Lithography

Preferred Qualifications:
� 5+ years industry experience in equipment engineering including tool installation/qualification specific to Lithography

� Knowledge of statistics and experimental design with the skills to apply that knowledge to tool installation, qualification and tool matching 

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.