Job Details:

Job Description: 

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Module Equipment Technicians perform functions associated with all Advanced Packaging production including operations, equipment, process, and training. Responsibilities may include, but are not limited to: � Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing. � Partnering with the production team to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility. � Perform plan preventive maintenance and other operational tasks on assigned equipment and process in 12 hours shift pattern � Perform 1st level troubleshooting, containment actions and reporting documentation on equipment/process stability issue in production line � Works with Engineers to support new equipment installations, sustaining, and process improvement initiatives � Train and certify junior technicians

Qualifications:

Minimum qualifications are required to be initially considered for this position. � Diploma in Mechanical/Electrical/Electronic/Mechatronic/Microelectronic with minimum 3-5 years experience in maintaining and troubleshooting Frontend Wafer Fabrication equipment in clean room environment � Ability to read, write and speak in English � Working hours will follow the shift schedule and crew that you are assigned to. Shift workers work four shifts of 12 hours a week, excluding overtime. Changes rotate between day and night each week. Day shift time is from 6:50 am to 7:00 pm and night shift is 6:50 pm to 7:00 a.m. Please note that this schedule is subject to change at the discretion of the Management. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. � Experience working with Chemical Delivery Equipment is preferred � Effective communication skill and exhibit learning mindset on new equipment and process technologies Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 14 AB (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.