Job Details:

Job Description: 

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. As a Module Engineer your responsibilities will include but are not limited to: � Provide Process and Equipment engineering leadership to the site organizations in support of safety, reliability, quality, environmental and Cost objectives for C4 TSV Thin Film � Owning safety within area of influence; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. � Own equipment install/conversion and qualification to ensure tools are installed safely on schedule, meeting all quality/matching criteria. � Own process development line items aligned to high volume process nodes. � Overlooking projects to meet design criteria, scope, budget, and schedule. � Oversight of planning, design, reconfiguration, construction, maintenance, and modifications to equipment, machinery, facilities systems as required to support business requirements. � Delivering operational efficiency, maintenance, testing and commissioning solutions. � Effective collaboration with construction and operations teams to coordinate work in the field. � Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability. The successful candidate should exhibit the following behavioral traits: � Customer Orientation. � Leadership and communication skills. � Develop creative approaches/solutions. � Self-starter, team player and leader. � Lead diverse, cross-functional, or cross-site teams. � Willingness to influence stakeholders at all levels of the organization. � Organization and prioritization skills.

Qualifications:

You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: � BS in Chemical/Mechanical/Mechatronic/Materials/Electrical Engineering or equivalent, with 3+ industry experiences in semiconductor field. � MS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with 2+ industry experiences in semiconductor field. � 3+ years Direct industry experience in Semiconductor Wafer Fabrication in Thin Film PVD / CVD equipment in Maintenance and/or Process Preferred Qualifications: � 5+ years Thin Film Equipment Owner � Knowledge of point using QCC tool, SPC, FMEA, 8D and Data Analysis for machine and process improvement/troubleshooting. � Knowledge of startup and commissioning of hardware and process equipment. � Knowledge of Thin Film PVD / CVD equipment including process transfer from reference site. � Effective communication skills with a high tolerance for ambiguous and dynamic situations. � Demonstrated learning mindset on new equipment and process competency building. � Ability to work fast and agile in a matrixed environment and build cohesive teams. � Proven track record in technical problem solving and able to provide solutions to overcome complex technical challenges.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.