Job Details:

Job Description: 

Join Intel and build a better tomorrow.

Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

As part of Intel's new IDM2.0 strategy, our high-volume manufacturing facility in Israel, Kiryat Gat is looking for amazing talent with experience in foundry, servicing customers both at a local and global level.

Join us and help create the next generation of technologies that will shape the future for decades to come.

As a Foundry Yield Device Engineer, your responsibilities may include but are not limited to:

• Drive the factory to produce transistor and discrete electronic devices that perform according to strictly defined specifications by collaborating with module, integration, and product engineers to perform specific actions and process modifications.
• Strictly control quality metrics at the end-of-line (EOL) screening step, disposition material by investigating root cause to assess risk and identify improvement opportunities.
• Strictly control quality metrics at in-line e-test and drive fast response to any device signal, Matching, T2T variation.
• Plan and conduct experiments to fully characterize transistor and discreet device performance through the development and high-volume manufacturing cycles; drive improvements on quality, reliability, cost, yield, process stability/capability, and performance.
• Interpret fab metrology, E-test, and yield process data, silicon-to-simulation analysis versus variability targets, layout effects, design rule assessments, and product parametric correlation to electrical monitor structures to find innovative product/process solutions and optimize product yield and performance.
• Drive response to customer requests and issues for process technology and manufacturing, such as performance or yield issues, and drive for solutions.
• Work with Process Integration and Yield Analysis teams to identify root cause of device-related yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets.
• Own all aspects of New Product Introduction (NPI) business process for customer to ensure successful NPI tape-out and lot delivery, including NPI sign-off criteria, product tape-out, lot planning, execution and tracking, lot health status summary based on inline, device performance, yield, reliability, and variability.

Qualifications:

Minimum Qualifications:

• Master of Science or PhD degree in Electrical Engineering, Physics, Material Science. Other related science and engineering degrees can be considered based on industry experience.
• 4+ years of experience in process integration, device physics, and product development on a leading-edge silicon-based logic process.
• Must have 2+ years of solid understanding on Device Physics and experience in FinFET technology development or high-volume manufacturing.
• 2+ years of experience within a Foundry YA/Device/Integration/Defect Metrology team, or foundry customer collaboration team, must have semiconductor development background in an advanced technology node.

Preferred Qualifications:

• 6+ years of experience in process integration, device physics, and product development on a silicon-based logic process, specifically in a foundry environment.
• A comprehensive understanding of device physics and semiconductor processing.
• Familiarity with failure analysis techniques.
• Expertise in data extraction, statistical analysis, and interpretation.
• Experience with Design of Experiment techniques.
• Experience of foundry customer interface and owning foundry NPI activities and trouble-shooting tape-out issues.
• Experience interpreting product data including inline, e-test and sort data in order to find failure root cause then identifying an inline indicator and driving for solutions.
• Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
• Experience with eight disciplines (8D) model, process control standards, E3 and SPC response strategy. Leading teams through end-to-end process.
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work effectively within a team environment.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Israel)

Primary Location: 

Israel, Kiryat-Gat

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.