Job Details:

Job Description: 

DAIS Customer Solution Engineering AI reshapes not only computing, but also business and society, Intel is making major bets on the future of AI and particularly in data center computing. Intel's Datacenter and AI Solutions (DAIS) organization is a critical part of Intel boarder AI efforts. Our DAIS responsibility spans data center workloads from generative AI and deep learning to analytics, HPC, and graphics - all of which are intertwined in the future of computing. Key Responsibilities : The Hardware Thermal Lead, will design and optimize high performance thermal solutions for Intel dGPU cards and systems. You will utilize your knowledge to influence upstream, internal, and external teams to ensure an optimized thermal system. This requires an in depth understanding of heat transfer fundamentals, to effectively generate thermal simulations, design experiments and validate heatsink designs. You will be aware of typical industry thermal technologies, and keen to explore new technologies to further push the envelope and achieve the best performance. You should be proficient at documenting your work and communicating with design partners or high-level management. In this role you will work in collaboration with engineers from all competencies of the system engineering team (Mechanical, PCB layout, board design, power design, etc.), the program management team, and teams outside of system engineering (software, etc.) to ensure products are delivered to both technical and schedule requirements. In addition, you may work with key OEM/ODM partners in support of their designs. Required Background This is a critical position within the Intel Data Center AI Solutions group. The successful candidate will have demonstrated a track record of delivering high quality designs on time, working with cross functional teams, and engaging with multiple partners. The market segments served by discrete graphics are fast moving, therefore the successful candidate shall demonstrate a high level of comfort with change and change management, as well as team collaboration with sites worldwide.

Qualifications:

Required Experience � Bachelor's/Master's in mechanical engineering or equivalent � Good Understanding of the fundamentals of heat transfer and fluid dynamics � 10+ years of experience delivering high performance thermal mechanical solutions for electronics applications (air cooled and/or liquid cooled) � Strong experience in design of Compute/Storage servers, racks from thermal perspective - Air cooled and liquid cooled � Good working knowledge of thermal simulation software such as Icepak (Strongly Preferred) or Flotherm or 6SigmaET � Understanding of tradeoffs between thermal and acoustic criteria � Excellent thermal debug/analysis skills and eagerness to jump into a problem to determine the root cause � Well organized, with good written and oral communication skills � Passionate about innovation and end to end ownership � Good knowledge of semiconductor, package, PCB and system design Desired Qualifications � Familiarity of tradeoffs between thermal and other design parameters (mechanical, electrical, etc.) � Familiarity with PCIe and OAM form factors � 3D Modelling experience with Creo/ProE or SolidWorks � Familiarity with OAM/OCP Products

          

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location: 

India, Bangalore

Additional Locations:

India, Hyderabad

Business group:

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.