MEMS Deposition Process Engineer - COR03 - Corvallis, OR B-3 (COR03) | Hewlett Packard Job

MEMS Deposition Process Engineer

Description -

Job Summary

The process engineer is a team member of the MEMS organization and is responsible for sustaining the existing generation of technology, leading and supporting the transition of products and manufacturing processes from prototype to full production, and for developing new processes in support of new product introduction or technology development. The process engineer is responsible for employing equipment technology, process technology and problem-solving methodologies to improve manufacturing performance, decrease proto cycles of learning, and enable the development of next-generation technology. The process engineer is the technical leader of their respective work center, and is expected to partner with world-wide work center counterparts, Operations, Integration Engineering and Product Engineering. The process engineer specifies and procures tooling and equipment needed to meet work center assurance of supply, and throughput requirements through the organization’s capital expenditure process. The process engineer also takes an active role in the MEMS quality system.

Responsibilities

• Technical owner of the Dielectric Deposition Process and tooling
• Uses Design of Experiment methodology to characterize process space and develop new production processes. Creates test plans to validate processes.
• Qualifies new production processes using organizational change management procedures, in partnership with engineering and operations stakeholders.
• Specifies new tooling and capital equipment purchases that are necessary for workcenter Assurance of Supply
• Leads the workcenter and drives improvement in the following key areas: process sustaining, quality, equipment and capacity, and process development.
• Exercises technical judgement, creativity, and initiative with attention to detail consistently throughout work output.
• Collaborates and communicates with management, worldwide engineering partners, internal, and outsourced development partners regarding status, project progress, and issue resolution.
• Leads project team of other process engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.
• Represents the workcenter team for all phases of larger and more- complex development projects.
• Solves difficult and complex problems with fresh perspective, demonstrating good judgment in selecting creative solutions and managing projects independently.
• Delivers professionally written reports, and supports realization of operational and strategic plans.
• Provides guidance and mentoring to less- experienced staff members to set an example of process design and development, innovation, and excellence.

Education & Experience Recommended

• Four-year or Graduate Degree in Chemical Engineering, Electrical Engineering, Materials Science, Physics, or other related discipline.
• Typically has 2-5 years of work experience, preferably in wafer or package fab process engineering, with experience in process development, stabilization, sustaining, and quality systems.
• Prior experience with Plasma Enhanced Chemical Vapor Deposition (PECVD) or related deposition processes strongly preferred.

Knowledge & Skills

• Process development and characterization
• Process qualification
• Change management
• Process and tooling
• Equipment specification
• Technical communication
• Electrical Engineering
• Chemical Engineering
• Materials Science
• Physics
• Wafer fab
• Package fab
• Plasma physics
• Plasma processes
• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• Statistical process control,
• Design of experiments, and problem-solving methodologies.

The pay range for this role is $83,000 to $127,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

 

 

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"