Job Details:

Job Description: 

Join an exciting and fast paced work environment.  You will be assisting with development of thermal, mechanical, and systems solutions for Intel® Data Center and AI group.   We are looking for a passionate, self-driven, proactive individual that is looking for Innovative new challenges and is willing to work with a highly interactive and motivated team.  You will be part of a multi-disciplinary global team which focuses on development of cooling solutions, mechanical retention mechanisms, platform, and system development.

In this role, the incumbent will assist in the development of data center thermal and mechanical solutions for various server and workstation market segments by working with a team of cross-site architects, mechanical, thermal, structural, and electrical engineers. The candidate may also assist with development of test fixtures and test automation.

Other duties to include but not limited:

• Work under the direction of a lead Engineer or Engineering Manager
• Perform mechanical testing of products
• Learn to understand and follow the engineering test protocols
• Gain trouble shooting techniques and solve defined engineering problems under guidance

Qualifications:

This position is not eligible for employment-based visa/immigration sponsorship.

Intel® sponsors individuals for employment-based visas for positions where we experience a shortage of US Workers. These skills shortage roles are typically STEM contributing positions requiring a master’s or PhD degree, or a bachelor’s degree with three years related job experience.

This position does not qualify for Intel® Sponsorship because it is either (1) a non-STEM contributing position, or (2) a STEM position that only requires a bachelor's degree and less than three years' experience.

Minimum Qualifications

• Must be pursuing a bachelor's degree in a Mechanical Engineering, computer engineering, electrical engineering, computer science, mechatronics or related field
• Experience or coursework in engineering fundamentals

Preferred Qualifications

Coursework or experience in the following:

• Python, C++ or other scripting languages
• 3D CAD tools like Creo or Solidworks
• CFD tools like FloTherm or IcePak
• FEA tools such as Abaqus or Ansys
• ·Mechanical structural and heat transfer processes

          

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.