Job Details:

Job Description: 

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Your responsibilities will include, but are not be limited to: � Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. � Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. � Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost goals. � Grows insitu manufacturing capacity to high volumes to demonstrate the technology expertise while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. � Owns execution of maintenance and repair activities for equipment and relevant module of components. � Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g. safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. � Owns process development line items aligned to high volume process nodes. � Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. � Owns development and optimization of excursion prevention systems for the equipment and process. � Owns detection of discrepant material or activities of the equipment and process. � During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). The ideal candidate should exhibit the following behavioral traits: � Must be a self-starter, highly organized, and have an ability to work independently across organizations. � Demonstrated skills to synthesize complex problems into clear messages and proposals through presentations, as well as communicating throughout the organization and factory. � Places high priority on the safety of themselves and those around them. � Skills to provide technical and tactical direction, problem-solving efforts and exerting influence with other organizations and management. � Troubleshoots, determines root-cause, and addresses equipment issues; prepares lessons learned documentation for all failures requiring multistep troubleshooting � Oversee installation, modification, upgrade, and maintenance of equipment as well as provide coaching to Technicians is a plus.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
� 3+ year of experience with Bachelors in Engineering or Technical field: Science/ Manufacturing/ Chemical/ Mechanical/ Mechatronic/ Electrical Engineering or equivalent
� or 2+ years of experience with Master / PHD in Engineering or Technical field
� Minimum 2 years of experience in Etch and/or plasma process and equipment.

Preferred Qualifications:
� Demonstrated competency in semiconductor tool installation, factory acceptance and qualifications capabilities
� Ability to work fast and agile in a matrixed environment and build cohesive teams.
� Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.