Job Details:

Job Description: 

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Responsibilities will include, but are not limited to: - Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing. - Partner with the production team to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility. - Work with Process Integration teams and Yield Analysis team to lead fast paced yield ramp-up in high-volume manufacturing phases. - Identify patterns and systematic defect issues in line and determining the root causes of defect involves complex problem-solving with mitigation plan in defined timeline to meet committed production yield targets. - Able to drive engineering projects to eliminate systematic defect issues with Process Integration, Yield Analysis and Fab module teams. - Recommend and execute production line inspection strategy to protect yield and quality at maximum productivity. - Experience in defect metrology tools and recipe creation is a plus. - Interact with partner factories worldwide to transfer new processes/technologies, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects. - Provide sustainable trainings and guide 24/7 manufacturing technician team to troubleshoot and resolve process issues. The ideal candidate should exhibit the following behavioral traits: - Strong analytical skills, problem-solving technique with self-initiative and self-learning capabilities. - Effective communication is crucial for conveying findings and recommendations to the stakeholders and able to explain complex technical concepts in a clear and understandable manner. - Demonstrated learning mindset on new technology, process and equipment competency building. - Ability to work fast and agile in a matrixed environment and build cohesive teams. - Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. - Bachelor, Master, or Ph.D. degree in Chemical/Mechanical/Mechatronic/Electrical/Manufacturing/Industrial Engineering or equivalent, with industry experiences in semiconductor field. - Bachelor Degree with minimum 3 years', Master Degree with minimum 2 years' or Ph.D. Degree with experience in wafer fab, defect yield analysis, manufacturing systems, yield improvement, problem solving and leading cross-functional teams. - Excellent communication skills with a high tolerance for ambiguous and dynamic situations.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.