Responsibilities 

Join SPPD Q&R team as an IC Quality and Reliability Manager. The successful candidate will be a member of a small team responsible for driving component product quality and reliability, test & stress infrastructure development, managing the ORT/ORM program, and responding to RMA-FA activities.   

Below are key required deliverables of this position: 

• Pre-PRQ: EIC Products Qualification 

• Execute pre-silicon reliability validation to ensure compliance to spec (intrinsic failure modes, ESD, etc.) 

• Execute post-silicon reliability testing and analysis (ESD, HTOL, Latch up, Packaging.) 

• Support fault isolation (FI) and failure analysis during development phase and customer returns. 

• Develop reliability test platforms and FA methods for new EIC Products. 

• Develop reliability stress capability thru internal capability and external capability. 

• Lead and manage relevant laboratory operation excellence, training and up keeping. 

• Post-PRQ: ORT/ORM Program and RMA-FA Management of EIC products 

• Lead and establish relevant business processes and service level agreement (SLA) for post-sales support model. 

• To be the voice of customers to FAB and OSAT operations, driving for yield and field failure continuing improvement.  

• To lead in mitigating/managing RMA-FA, MRB/taskforce 

• Data analytics, database maintenance and pareto trend analysis towards continuous improvement efforts for field failures.  

• To lead regulatory and ecology certifications. 

• Establish ORT/ORM program.  

Also, it is expected that the best matched candidate demonstrates behavioral traits of:  

• Highly motivated, self-driven, and problem-solving mentality.  

• Sense of urgency and commitment to achieve targeted goals. 

• Collaborative across functional and organizational boundaries. 

• Excellent communication, documentation, and presentation skills.  

The successful candidate must possess the minimum qualifications listed below to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through relevant previous job and research experiences, both in academic institutes and in industry.  
 

Minimum qualifications  

• BS degree in Electrical Engineering, Computer Engineering, Physics or related technical field. 

• Semiconductor device physics knowledge. 

• 3+ years’ experience with high-speed circuit characterization, pre-silicon validation, and reliability testing. 

• 3+ years’ experience with enabling EIC component reliability test and stress capability. 

• 3+ years’ experience with testing systems and instrumentation automation control including hardware and software (Matlab, LabView, Minitab, Python.)  

• 3+ years’ experience in data analytics in product reliability and risk analysis. 

• 3+ years’ experience in FI/FA of EIC components. 

• 3+ years’ experience in device analytical/characterization techniques (SEM/EDX, AFM, X-Ray imaging, IR imaging, surface analysis techniques, etc.) 

• 3+ years’ experience of JEDEC standard testing methodologies.  

• Die sort/class test knowledge. 

• Die packaging knowledge. 

• Capable of leading a small team and independently driving/managing all activities from initial idea to final fulfillment. 

• Clear verbal and written communication skills. 

• Capable of influencing technical partners based on analysis and data.   

Preferred qualifications (in addition to the minimum qualifications) 

• MS degree in Electrical Engineering, Computer Engineering, Physics, or related technical field. 

• 5+ years’ experience with high-speed and mixed-signal EIC product qualification. 

• 5+ years’ experience in device analytical/characterization techniques (SEM/EDX, AFM, X-Ray imaging, IR imaging, surface analysis techniques, etc.)