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Product Packaging Engineer Intern - AHB1 - AHB1 - Ambassador Hotel Building

10 days ago


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Job Opportunity Details

Type

Full Time

Salary

Not Telling

Work from home

No

Weekly Working Hours

Not Telling

Positions

Not Telling

Working Location

AHB1 - AHB1 - Ambassador Hotel Building, Taiwan, Province Of China   [ View map ]

Job Details:

Job Description: 

Responsibilities may be quite diverse of a technical nature.

  • Intel advanced packaging technology pathfinding project management

  • Integration of packaging processes/designs/simulation/test/reliability/ Failure Analysis (FA) according to Intel biz process

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • With a valid in-school student status

  • Currently in 3rd/4th year of college or 2nd year of graduate students are recommended

Preferred Qualifications:

  • The candidate must be an active student currently pursuing degrees/master/PHD in Material science, physics, chemical/electronic/electrical/mechanical engineering

  • Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Taiwan)

Primary Location: 

Taiwan, Hsinchu

Additional Locations:

Business group:

Intel's Global External Manufacturing & Sourcing (GEMS) organization plays a pivotal role in Intel's IDM 2.0 strategy, driving Manufacturing, Innovation, and Product Leadership to new heights. We are on a mission to strengthen our partnerships with third-party foundries, which currently produce a diverse array of Intel technologies, spanning communications, connectivity, graphics, and chipsets. As we embark on this exciting journey, we anticipate a significant expansion in Intel's collaboration with third-party foundries. This expansion will encompass the manufacturing of a variety of modular tiles on cutting-edge process technologies, including products that lie at the heart of Intel's computing solutions for both client and data center segments. At GEMS, our dedicated team of engineers, supply chain experts, and manufacturing professionals are committed to delivering the increased flexibility and scalability required to finely tune Intel's roadmaps. We focus on optimizing cost, performance, schedule, and supply, providing Intel with a distinct competitive edge in the industry. Join us at Intel's GEMS organization and be part of a team that's at the forefront of driving innovation and excellence in external manufacturing. Together, we will shape the future of technology and contribute to Intel's global leadership in the semiconductor industry. Your expertise and passion can make a significant impact in this dynamic and rapidly evolving landscape.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

More Information

Application Details

  • Organization Details
    791 Intel Microelectronics Asia LLC, Taiwan Branch
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