Mechanical Engineer - SOH01 - Singapore HP Campus Block 1 (SOH01)

Mechanical Engineer

Description -

We're looking for Mechanical Engineers with the following expertise.

- Mechanical Design

- Thermal and Performance

- Tooling

This role be based in Singapore Design Center. As be part of the HP Personal System Global R&D team, this design center will focus on NB/PC products.

The responsibilities will include

• Engage with HP engineering team and ODM development team and/or sub supplier partners on Gen-to-Gen projects NPI development activities as a key function team player (DFM review, key milestone parts readiness control, leads key issues FA and resolution validation, make sure the ME/Tooling/Thermal parts can catch up with the MP timey and in quality…)  

• Engage with HP ID/CMF team on new generation projects key features feasibility assessment from manufacturing and mass production perspectives. 

• Identifies and evaluates new technologies, innovations, and works with outsourced development partner relationships for aligned with technology roadmap and business goal; creates plans for integration and implement into related projects. 

• Review and evaluate designs and project activities for compliance with technology and development guidelines and standards; integrates suggestions, updates, and innovations into overall architecture. 

• Lead projects that affect the organization's long-term goals and objectives. 

• Routinely exercise independent judgment in developing methods, techniques and criteria for achieving objectives. 

• Lead multiple project teams of other engineers and outsourced development partners responsible for all stages of mechanical, and thermal development for complex products and platforms, including solution design, validation, tooling and testing.

• Provide domain-specific expertise and overall thermal/performance leadership and perspective to cross-organization projects, programs, and activities.

• Drive innovation and integration of new technologies into projects and activities in the thermal and performance design organization.

• Develop strategy and set functional policy and direction.

• Leverage recognized domain expertise, business acumen, and experience to influence decisions of executive business leadership, outsourced development partners, and industry standards groups.

We’re looking for talents with

• Mechanical Engineering background.

• 8+ years experience in mechanical/thermal/tooling related design.

• NB/PC product experienced is highly preferred.

• Familiar with design tools.

• Excellent analytical, problem solving, and communication skills.

• Evaluating and proposing forms of empirical analysis, modeling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management.

• Ability to effectively communicate product architectures, design proposals and negotiate options at senior management levels.

HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.

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Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

Relocation -

EEO Tagline - 

HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.