Senior Mechanical Engineer – Hybrid Solutions (Poly) - TNN01 - Level 25 to Level 28 (TNN01)

Senior Mechanical Engineer – Hybrid Solutions (Poly)

Description -

The Senior Mechanical Engineer is a critical role within the HP Hybrid Solutions (Poly) team.  Working with a global design team, this position drives execution on all aspects of the mechanical design of new videoconferencing products over multiple projects with outsourced development partners.  Central to the success of this role is the ability to drive execution at ODM vendors and interface with a multinational team to solve complex technical issues.  This individual should have experience driving aggressive schedules, reviewing complex mechanical designs including providing technical guidance, working with vendors to resolve complex mechanical problems using data-driven decision-making, and experience in delivering mass-produced hardware.

Responsibilities:

• Leads multiple project teams of other mechanical hardware engineers at outsourced development partners responsible for all stages of mechanical and thermal development for complex products, including design, validation, tooling, and testing.

• Manages relationships with internal and outsourced development partners on all aspects of mechanical design.  This will be across multiple global locations, including the design architecture team that is based in the USA.

• With the global development team, ensure all mechanical engineering aspects of product development including thermal management, FAI (first-article inspection), DFM (design for manufacturing), and CMF (color, materials, finish). 

• Reviews and evaluates designs for compliance with development guidelines and standards; provides tangible feedback to improve product quality.

• Provides domain-specific expertise and overall mechanical hardware leadership to cross-organization projects, programs, and activities.

• Drives innovation and integration of new technologies into projects in the mechanical hardware design organization.

• Provides guidance and mentoring to less-experienced staff members.

Education and Experience Required:

• Bachelor's or Master's degree in Mechanical Engineering or related engineering field

• Requires 10+ years of experience, including at least 5 years of experience in developing mass-produced product.

Knowledge and Skills:

• Significant experience with Creo Parametric, Siemens NX or other 3D CAD software as a mechanical design tool.

• Excellent analytical and problem-solving skills.

• Experience in mechanical and thermal architecture of electronics packaging design.

• Direct experience designing metal and plastic parts including associated production tooling, and is familiar with production processes for fabrication and assembly of such parts.  Familiarity with design rules for mass production of mechanical parts in support of DFM.

• Has been able to run and understand ME CFD analysis.

• Thermal CFD analysis with thermal mockups to validate thermal solutions will be bonus skill.

• Excellent written and verbal communication skills; mastery in both English and Mandarin languages.

• Ability to effectively communicate product architectures, design proposals and negotiate options at senior management levels.

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Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Taiwan)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement