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Mechanical Engineer Hewlett-Packard Labs - PAL02 - Palo Alto, CA B-2 (PAL02)

7 days ago


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Job Opportunity Details

Type

Full Time

Salary

Not Telling

Work from home

No

Weekly Working Hours

Not Telling

Positions

Not Telling

Working Location

PAL02 - Palo Alto, CA B-2 (PAL02), California, United States   [ View map ]
Mechanical Engineer Hewlett-Packard Labs

Description -

The Microfluidics and System Technology* at HP Laboratories in Palo Alto, California, is seeking an outstanding mechanical engineer to join its elite R&D team working on breakthrough technologies in the microfluidics and life sciences fields.

The new engineer will work with a team of leading researchers, including physicists, mechanical engineers, material scientists, chemists and software engineers, with the aim of impacting HP’s business and products through fundamental research and applied science.

The role involves designing and building microfluidic devices and cartridges, developing novel molecular diagnostic systems, and fabricating and testing complex platforms and tools. The engineer will also plan and conduct experiments to validate, diagnose and improve performance or test alternative subsystem designs.

Other roles: Develop and innovate in a broad range of technical areas to solve multidisciplinary problems, addressing issues which involve materials properties, chemistry, physics, thermal design, fluid flow, and control systems. Use computer-aided design (CAD) and simulation tools (COMSOL).

* https://www8.hp.com/us/en/hp-labs/research/overview.html#!PAM-lab  

Job qualifications

  • This position is for an outstanding MS in Mechanical Engineering.
  • Great hands-on skills and attention to detail
  • 5 years or more of experience in a similar R&D environment
  • Highly self-motivated individual with conscientious work habits, able to communicate clearly, and able to collaborate effectively with other members of the project team.
  • Background in molecular biology or chemical engineering - a big advantage
  • Background in fluid flow, micro fluidics, or thermal design – a plus
  • Background in F/W and S/W. Familiarity with control systems – a plus.
  • Knowledge of fundamental physics - a plus.
  • Demonstrated ability to design and innovate in a highly multidisciplinary environment.
  • Demonstrated ability to define and implement innovative research experiments to enable engineering breakthroughs.
  • Demonstrated experience with prototyping and fabrication processes (mills, lathes, laser cutters, 3D printing).

The team research involves work on the following Areas:

  • Physics
  • Mechanics
  • Materials Sci.
  • Electronics
  • Chemistry
  • Firmware
  • Software
  • Automation
  • Control systems
  • 3D printing
  • Digital printing
  • New platforms
  • Products

Other guidance:

  • Please include your GPA
  • Please share with us work that you did and can be shared (non-confidential) of mechanical systems, machinery, things you built etc. Please include photos and diagrams if possible.

Please apply in HP or send us your resume to PCDL.CPE@gmail.com

HP offers a comprehensive benefits package, including:

  • Dental insurance
  • Disability insurance
  • Employee assistance program
  • Flexible schedule
  • Flexible spending account
  • Health insurance
  • Life insurance

 Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. The typical base pay range for this role across the U.S. is $117,000 -- $160,000 annually with additional opportunities for pay in the form of bonus and/or equity. Pay within this range varies by work location and may also depend on job-related knowledge, skills, and experience. Your recruiter can share more about the specific salary range for the job location during the hiring process.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement


More Information

Application Details

  • Organization Details
    HP / Hewlett packard
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