Senior Package Design Engineer - Israel, Yokneam

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.

NVIDIA, a world-class technology company, is seeking a passionate Senior Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you'll be doing:

• Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

• Collaborating with world-leading vendors to develop highly ambitious packaging solutions

• Thriving in a dynamic and challenging environment

• Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

What we need to see:

• BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar

• At least 5 years of experience with complex ASIC package development and manufacturing

• Hands-on FEA mechanical simulation experience

• Experience co-working with subcontractors and vendors

• Vision and focus for projects and team

• Curious and creative problem solver as well as organized and multi-tasker

• Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

• High awareness of quality, manufacturability and project schedule

Ways to stand out from the crowd:

• Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)

• Background in semiconductor manufacturing processes

We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.